Product
Vitrified bond diamond grinding wheel Silicon wafer back grinding wheels are specifically designed for thinning and precision grinding of silicon wafers.
Vitrified bond diamond grinding wheel Silicon wafer back grinding wheels are specifically designed for thinning and precision grinding of silicon wafers.
Vitrified bond diamond grinding wheel Silicon wafer back grinding wheels are specifically designed for thinning and precision grinding of silicon wafers.
Vitrified bond diamond grinding wheel Silicon wafer back grinding wheels are specifically designed for thinning and precision grinding of silicon wafers.
+
  • Vitrified bond diamond grinding wheel Silicon wafer back grinding wheels are specifically designed for thinning and precision grinding of silicon wafers.
  • Vitrified bond diamond grinding wheel Silicon wafer back grinding wheels are specifically designed for thinning and precision grinding of silicon wafers.
  • Vitrified bond diamond grinding wheel Silicon wafer back grinding wheels are specifically designed for thinning and precision grinding of silicon wafers.
  • Vitrified bond diamond grinding wheel Silicon wafer back grinding wheels are specifically designed for thinning and precision grinding of silicon wafers.

Vitrified bond diamond grinding wheel Silicon wafer back grinding wheels are specifically designed for thinning and precision grinding of silicon wafers.

Product Category:

Vitrified Bond

This vitrified bond diamond grinding wheel is engineered specifically for the back-grinding (thinning) process of silicon wafers in semiconductor manufacturing. It is designed to achieve ultra-fine surface finishes, exceptional thickness uniformity, and minimal subsurface damage, preparing wafers for subsequent dicing or CMP (Chemical Mechanical Planarization) processes with high precision and yield.

saisudiamond@163.com

+86-17339586706

Applications
Get a quote
Products Manual
  • Product Description
    • Commodity name: Vitrified bond diamond grinding wheel Silicon wafer back grinding wheels are specifically designed for thinning and precision grinding of silicon wafers.

    This vitrified bond diamond grinding wheel is engineered specifically for the back-grinding (thinning) process of silicon wafers in semiconductor manufacturing. It is designed to achieve ultra-fine surface finishes, exceptional thickness uniformity, and minimal subsurface damage, preparing wafers for subsequent dicing or CMP (Chemical Mechanical Planarization) processes with high precision and yield.

    Other attributes

    Material

    Diamond

    Customized support

    ODM, OEM

    place of origin

    Henan, China

    Brand name

    SaiSu

    Size

    As required

    Material

    Diamond + Aluminum Base

    Usage

    Back grinding

    Product Description

    1. Engineered for Ultra-Precision & Minimal Subsurface Damage – The unique vitrified bond formulation and fine-grit diamond abrasive are optimized to remove material efficiently while minimizing micro-cracks and stress in the brittle silicon crystal lattice, which is critical for maintaining wafer strength and device performance.

    2. Superior Flatness & Thickness Control for Advanced Nodes – Delivers exceptional parallelism and thickness uniformity across the entire wafer, meeting the stringent tolerances required for stacking, 3D packaging, and high-density integrated circuit manufacturing.

    3. Clean, Consistent, & High-Yield Production Performance – Produces a consistently fine surface with low roughness, generates less debris, and offers stable grinding performance, contributing to higher throughput, reduced defect rates, and improved overall process control in a cleanroom environment.

    Product attributes

     

    Product picture

     

Hot Tags:

Silicon Wafer Back-Grinding Wheel

Semiconductor Thinning Diamond Wheel

Precision Wafer Fine Grinder

PREVIOUS:

Vitrified / Resin Bonded Double-Ended Diamond and CBN Grinding Wheels – Ideal for Grinding Seals, Magnetic Materials, and High-Voltage Components

NEXT:

Vitrified CBN internal grinding wheels suitable for high-speed steel, stainless steel, carbon steel, titanium alloys, and cast iron grinding.

Products Manual

Product

Recommendation

Electroplated diamond dresser Thread-Tapping Industry Multi-Line Diamond Rollers P = 0.5 / 0.75 / 0.8 / 1.0 / 1.25 / 1.5 / 1.75 / 2.0 / 2.5

Electroplated diamond dresser Thread-Tapping Industry Multi-Line Diamond Rollers P = 0.5 / 0.75 / 0.8 / 1.0 / 1.25 / 1.5 / 1.75 / 2.0 / 2.5

This series of electroplated diamond dressing rollers is engineered for precision profiling and dressing of grinding wheels used in manufacturing multi-start taps. Covering a comprehensive range of standard pitches from P0.5 to P2.5, each roller is designed to accurately replicate complex, multi-lead thread geometries, ensuring consistent wheel form and high repeatability in CNC thread grinding operations for tap production.
Discover more
Customizable diameter, inner bore, and profile—natural diamond shaped diamond rollers designed for grinding wheel dressing, featuring advanced electroplating technology.

Customizable diameter, inner bore, and profile—natural diamond shaped diamond rollers designed for grinding wheel dressing, featuring advanced electroplating technology.

This Fully-Custom Natural Diamond Electroplated Roller offers a complete bespoke solution for grinding wheel form dressing. We provide end-to-end customization of every critical parameter: outer diameter, inner bore, and the precise working profile, all finished with a premium layer of natural diamond grit via advanced electroplating technology. This holistic approach ensures the roller is not just a tool, but a perfect mechanical and functional extension of your specific CNC grinder and application, delivering unparalleled fit and performance for your unique profiling needs.
Discover more
Electroplated process using natural diamond material, diamond roller for CNC grinding machine grinding wheel dressing

Electroplated process using natural diamond material, diamond roller for CNC grinding machine grinding wheel dressing

This Natural Diamond Electroplated Form Roller is a high-performance dressing tool engineered for CNC grinding machines. It utilizes a precision electroplating process to bond a uniform layer of premium natural diamond grit onto a custom-shaped form substrate. This combination delivers an exceptional balance of intrinsic material toughness and superior dressing sharpness, designed for form dressing operations that demand reliable profiling accuracy, excellent surface finish, and consistent performance across challenging materials and demanding production cycles.
Discover more

Get

A Quote

Please leave your email address, our professionals will contact you as soon as possible!

Submit
%E7%AC%AC%E4%B8%80%EF%BC%8C%E6%9C%80%EF%BC%8C%E4%BC%98%E7%A7%80%EF%BC%8C%E5%A2%9E%E5%BC%BA%EF%BC%8C%E4%B8%80%E6%B5%81

Sorry，当前栏目暂无内容!

您可以查看其他栏目或返回 首页

Sorry，The current column has no content!

You can view other columns or return Home

Get

A Quote

Leave us a message and get access to exclusive offers, product updates, and expert advice tailored just for you!

*is requiredl You can ask any questions in the company including products.Please ill in the correct contact infomation so that we can reply to youin time!

Submit
%{tishi_zhanwei}%